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The US-China Chip War: How Semiconductor Restrictions Are Reshaping Global Alliances in 2026

Ramo by Ramo
12 July 2026
in AI & Tech, Politics & Geopolitics
406 17
0
ASML Holding CEO Christophe Fouquet during interview about semiconductor technology

Christophe Fouquet, chief executive officer of ASML Holding NV, arrives for a Bloomberg Television interview at the company's headquarters in Veldhoven, Netherlands, on Friday, Nov. 14, 2025. "Better lithography means better resolution, better accuracy and better productivity. And we're going to work basically on those three axes for many, many years." Fouquet said. Photographer: Wiktor Dabkowski/Bloomberg via Getty Images

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The global semiconductor industry has become the central battleground in the escalating technology rivalry between the United States and China. Export controls, investment restrictions, and technology transfer bans have reshaped supply chains, created new geopolitical alliances, and forced every nation to reconsider its position in the microchip ecosystem. As of mid-2026, the semiconductor landscape looks fundamentally different than it did just three years ago.

The stakes could not be higher. Semiconductors are the foundation of modern civilization — powering everything from smartphones and cars to military systems and artificial intelligence. Whoever controls the advanced chip supply chain controls the technological future. This article examines how the US-China semiconductor conflict is reshaping global alliances and what it means for the world economy.

The Evolution of US Export Controls: From Huawei to Comprehensive Restrictions

The United States began tightening semiconductor export controls in 2022, initially targeting Huawei Technologies with restrictions designed to cut the Chinese telecom giant off from advanced chips and chip-making equipment. These controls expanded throughout 2023 and 2024, culminating in the most sweeping restrictions yet announced in late 2025.

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By July 2026, the US export control regime covers nearly every category of advanced semiconductor technology. This includes restrictions on:

  • Export of advanced lithography equipment needed to manufacture sub-7nm chips
  • Sale of electronic design automation (EDA) software used for chip design
  • Transfer of semiconductor manufacturing know-how and specialized materials
  • Export of high-bandwidth memory (HBM) chips essential for AI accelerators
  • Access to US cloud computing infrastructure for training advanced AI models

These controls are enforced through a “foreign direct product rule” that extends US jurisdiction to any chip or equipment made using American technology, regardless of where it is manufactured. This extraterritorial reach has been controversial among US allies, who argue that it creates legal uncertainty for their own companies.

The impact on China has been significant. Domestic chip production capacity for advanced nodes remains severely constrained. Chinese companies like SMIC (Semiconductor Manufacturing International Corporation) have managed to achieve limited 7nm production using deep ultraviolet (DUV) lithography, but yields are low and costs are high. The gap between Chinese and global-leading chip fabrication continues to widen.

China’s Response: Accelerating Self-Sufficiency and Building Alternative Supply Chains

China has not taken the US restrictions lying down. Beijing has poured hundreds of billions of dollars into domestic semiconductor development through initiatives like the “Big Fund” (National Integrated Circuit Industry Investment Fund), now in its third phase. The focus has shifted from trying to match leading-edge nodes to building self-sufficiency in mature-node chips (28nm and above) that are still vital for automotive, industrial, and consumer electronics applications.

Chinese companies have made notable progress in several areas:

  • Domestic production of silicon carbide (SiC) wafers for power electronics has grown rapidly, with Chinese firms now controlling over 30 percent of the global market
  • Development of alternative lithography techniques, including self-assembling block copolymers and directed self-assembly (DSA), which could bypass some EUV limitations
  • Investment in advanced packaging technologies (chiplet architectures, 3D stacking) that can improve performance without requiring the most advanced node sizes
  • Expansion of RISC-V ecosystem as an alternative to ARM and x86 processor architectures

Perhaps most significantly, China has been aggressively building what it calls a “dual circulation” semiconductor ecosystem — one that remains connected to the global economy where possible but can operate independently if necessary. This involves stockpiling critical equipment and materials, developing domestic substitutes for every category of imported chip, and forging technology partnerships with Russia, Iran, and North Korea.

Europe’s Pivotal Role: Balancing Sovereignty with Alliance Commitments

The European Union has found itself in an increasingly difficult position. On one hand, Europe shares the United States’ concerns about China’s technology ambitions and has implemented its own screening mechanisms for foreign investment in sensitive technologies. On the other hand, European companies like ASML — the Dutch manufacturer of the extreme ultraviolet (EUV) lithography machines essential for advanced chip production — are directly affected by US export controls and want continued access to the Chinese market.

The Netherlands has become a focal point of this tension. ASML’s EUV machines are arguably the most strategically important pieces of industrial equipment in the world. Every advanced chip made anywhere — from Taiwan’s TSMC to South Korea’s Samsung — depends on ASML’s technology. The Dutch government has walked a careful line, complying with US-led export restrictions while resisting pressure to expand them further.

In early 2026, the European Commission proposed the “European Chips Act 2.0,” a 50 billion euro package designed to double Europe’s share of global semiconductor production to 20 percent by 2030. The plan includes subsidies for new fabrication plants (fabs), investment in advanced packaging and R&D, and measures to attract skilled semiconductor engineers from around the world.

Germany has emerged as Europe’s semiconductor manufacturing hub. Intel’s massive fab complex in Magdeburg and TSMC’s specialized plant in Dresden represent tens of billions of dollars in investment. These facilities are designed to produce chips for automotive and industrial applications — a sector where European companies remain global leaders but face increasing competition from Chinese manufacturers.

Related: Global Semiconductor Supply Chain in 2026: How US-EU Chip Alliances Are Reshaping the Industry

The Rise of Chip Alliances: US-EU-Korea-Japan Coordination

The most significant geopolitical development of 2025-2026 has been the formation of the “Chip 4 Plus” alliance — an expanded version of the original US-Japan-Korea-Taiwan chip coordination group that now includes the Netherlands, Germany, and the United Kingdom. The alliance aims to create a trusted semiconductor supply chain that minimizes dependence on China while ensuring stable access to advanced chips for all members.

Key initiatives of the Chip 4 Plus alliance include:

  • Coordinated export control enforcement to prevent technology leakage to China through third countries
  • Joint investment in next-generation lithography research, including high-NA EUV machines and beyond-EUV technologies
  • Establishment of a shared semiconductor talent pool and exchange programs for engineers
  • Development of common standards for chip security, including hardware-level attestation and supply chain verification
  • Creation of strategic chip reserves to buffer against supply disruptions from natural disasters or geopolitical crises

Implications for the Global Economy and Consumers

The fragmentation of the global semiconductor market has real economic consequences. Chip prices for advanced nodes have increased by 15-25 percent since 2023 due to supply constraints and the cost of building redundant fabrication capacity across multiple countries. AI accelerators, in particular, remain in short supply, with lead times stretching to 12-18 months for the most advanced designs.

Consumers are feeling the impact through higher prices for electronics, longer wait times for new devices, and reduced choices in certain markets. Chinese smartphone manufacturers, for example, have shifted to using domestic chips that offer performance roughly two to three years behind the global cutting edge. In automotive markets, the shortage of mature-node chips (used in everything from engine control units to infotainment systems) has delayed vehicle production and increased car prices worldwide.

Looking ahead, the semiconductor landscape will likely remain fragmented for the foreseeable future. The era of a single, globally integrated chip supply chain is over. What emerges will be a system of overlapping regional blocs, each with significant but incomplete capabilities. The nations and companies that adapt most effectively to this new reality will define the technological trajectory of the next decade.

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Ramo

Ramo

Ramo is the editorial voice of Mylistingo — an AI and technology news platform based in The Hague, Netherlands. Covering artificial intelligence, machine learning, robotics, and the future of technology, Ramo delivers accurate, accessible reporting for both general audiences and industry professionals. Every article is fact-checked and written to meet Mylistingo's strict no-fabrication editorial standards.

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